Compact 3D-system for electronics component scanning, is high-resolution
Fine-grained structures in the electronics and semiconductor industry can be scanned and inspected, says EVT, using EyeVision 3D and the high-resolution EyeScan AT 3D laser triangulation sensor.
EyeScan AT 3D models, the sensor C5-1280CS35-12 with a z-resolution of 0.2 micron or the sensor model C5-1280CS25-20 with a z-resolution of 0.4 micron, are available. Both sensors scan with high speed and have 120kHz scan frequency. With over 1280 points per profile all components can be scanned and inspected with the highest accuracy, claims EVT.
The compact model form enables the sensor to fit into almost every machine, according to the company.
EyeVision 3D Software can process different evaluations in the point cloud with commands that are easy to handle. The combination of EyeVision 3D software and EyeScan AT 3D scanner is suitable for measuring and inspecting small and filigree component parts, such as used in the electronics industry, capturing high contrast 3D images and point clouds, also of parts, with reflexive surface or parts with dark characteristics and detecting presence and position of soldering paste as well as detection of lifted leads.
