Compact converters implement faster calculations for next-gen SoCs
Two converters join the EZBuck regulator series by Alpha and Omega Semiconductor.
Explaining the need for the AOZ2367QI and the AOZ2368QI, Alpha and Omega Semiconductor, the company cites the next-generation microprocessors and SoCs which require more power to do fast-speed calculation and the need for more add-on functions. Implementing much higher output power in a DC/DC converter often requires the use of several external components such as high current and low turn-on resistance MOSFETs. The 20A AOZ2367QI and the 25A AOZ2368QI integrate Alpha and Omega’s MOSFET technology to power next generation high-end systems and its packaging expertise to improve thermal management capabilities for a stable and robust environment.
The AOZ2367QI and AOZ2368QI can be used in high-end TVs, servers, data storage systems, networking and other compact PC systems, adds the company. They enable high efficiency over the entire load range with low on resistance in the range of one to 4mOhm, and light-load efficiency that gets a further boost with an optional pulse frequency mode (PFM).
The 20A and 25A devices are all available in a footprint compatible QFN 5.0 x 5.0mm package allowing designers an upgrade path as power requirements increase. The devices operate over a wide input voltage range of 4.5 to 24V with output voltages adjustable down to 0.6V. The proprietary COT architecture provides fast load transient response performance and allows a stable and low voltage ripple operation with small size ceramic capacitors. According to Alpha and Omega Semiconductor, competing solutions require several external components when using all ceramic capacitors and need to generate a larger output ripple voltage to stabilise the circuit. In addition, the input feed forward feature provides a constant switching frequency over the entire input voltage range, which further alleviates noise concerns.
A pin-compatible footprint from 20 to 25A also minimises the overall design space with less external components to achieve power density, points out the company.
