Compact SMT high current chokes need less PCB space, says TDK

Epcos ERU-SMT power inductors from TDK now include the ERU19, ERU24 and ERU27 (B82559) series. There are up to 10 types in each family, covering inductance values from 1.0 to 30 microH. They cover a range of saturation currents at 25 degrees C from 11.5A to 101.5A DC.

The inductors have a footprint ranging from just 19.9 x 18.5mmto 27.8 x 25.8mm2. As a result, says TDK, they take up 14 per cent less space on the PCB than their predecessor. The low insertion heights (between 7.65 and 16.9mm) vary depending on the type of inductor. The low-profile design is based on a flat rectangular helical winding technology, resulting in lower losses, adds the company.

The Ohmic resistances are between 0.46 and 17.0 mOhm. The high current chokes are designed for operating temperatures between -40 and +150 degrees C. The inductors have an additional soldering pad which contributes to high mechanical stability on the PCB.

The inductors are RoHS-compatible and AEC-Q200-qualified. They are intended to be used as output and storage chokes in a variety of power supply topologies. Use cases include point of load (PoL) converters, DC/DC converters, high current switch mode power supplies and inverters for photovoltaic systems and automotive applications.

TDK was established in 1935 to commercialise ferrite, a key material in electronic and magnetic products. TDK’s portfolio features passive components such as ceramic, aluminium electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. TDK also provides power supplies and energy devices and magnetic heads. Products are marketed under the brands TDK, Epcos, InvenSense, Micronas, Tronics and TDK-Lambda. TDK serves demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and North and South America.

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