congatec develops COM-HPC Mini form factor

To mark the ratification of the COM-HPC 1.2 specification, congatec has introduced the COM-HPC Mini module.
The new PICMG COM-HPC 1.2 specification introduces the COM-HPC Mini form factor which provides high performance capabilities in a small form factor and measures 95 x 70mm. Even devices with limited space can now benefit from the superior bandwidth and interface offerings of COM-HPC, including PCIe Gen 5 and Thunderbolt, said congatec.

COM-HPC is described as the most scalable computer-on-module (CoM) standard, said congatec, covering a wide range of applications from small form factor designs to edge server designs. This simplifies the design-in process and enables the creation of complete product families with reduced engineering efforts. COM-HPC modules support not only specific processors like x86 or Arm but also FPGAs, ASICS, and AI accelerators. According to congatec, this makes it a comprehensive standard for developing innovative applications based on the latest embedded and edge data processing technologies.
Christian Eder, chairman of PICMG’s COM-HPC Working Group and director of market intelligence at congatec, said: “COM-HPC offers the highest performance, bandwidth, interfaces, and scalability compared to other computer-on-module standards and with COM-HPC Mini, engineers can now leverage all this on a real small form factor for space constrained embedded and edge computing designs.”
congatec is committed to supporting the adoption and implementation of the COM-HPC Mini specification, said the company.
congatec is focusing on embedded and edge computing products and services. The computer modules are used in a wide range of applications and devices in vertical markets, including industrial automation, medical technology, robotics and telecommunications.

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