Congatec module aims for embedded AI with PCIe connections
Congatec has released a computer-on-module (COM) for embedded applications based on Intel’s Core i3-8100H processor platform.
The quad-core processor module includes support for up to 32GB of low-power, high-bandwidth DDR4 RAM. It also includes 16 PCIe lanes for connection to multiple GPUs. Congatec says this suits the module to applications that require high-performance machine-learning support, with training and inferencing offloaded to the GPUs. For power-efficient graphics display, the module has integrated Intel HD graphics based on the UHD 630 processor.
“The 3 GHz quad-core Intel Core i3 processor and the new HM370 Platform Controller Hub offer a particularly high performance per watt ratio as well as an unbeaten performance per dollar ratio,” said Martin Danzer, director of product management at Congatec. “The price has fallen significantly – so customers can now serve even the most computational intensive AI applications at an affordable price level.”
With support for DDR4 2400 memory, the module provides improved bandwidth compared to the preceding seventh generation of Intel Core processors. The improved memory bandwidth also helps to increase the graphics and GPGPU performance of the integrated new Intel UHD630 graphics, which can run its 24 execution units at up to 1GHz. The built-in graphics interface supports up to three independent 4K displays.
For I/O, the COM includes four USB 3.1 Gen 2, eight USB 2.0 and eight PCIe Gen 3.0 lanes, with the latter offering high bandwidth connection to Intel’s non-volatile Optane memory as well as GPUs.
All common Linux operating systems, as well as the 64-bit versions of Microsoft Windows 10 and Windows 10 Internet of Things, are supported by the COM and Congatec’s personal integration support rounds off the feature set.
In addition, Congatec offers a range of accessories and technical services to simplify the integration of new modules into customer-specific solutions.
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