congatec syncs with Intel Core launch with embedded computer modules

Two design options, a COM-HPC and a COM Express module, have been launched by cognate, in parallel with the 11th Gen Intel Core processor launch (code named Tiger Lake).

The company’s first COM-HPC Client size A module and a next-generation COM Express Compact computer on module (COM) offer engineers the choice to scale the performance of existing systems or develop the next-generation of products using COM-HPC’s broader array of interfaces. The modules boast “substantial” performance improvements and communication enhancements by virtue of the 11th Gen Intel Core processors which target high end computing in embedded systems and edge computing nodes, network hubs and local fog data centres, core network appliances, as well as ruggedised central cloud data centres for critical government applications.

“congatec’s modules based on the 11th Gen Intel Core processors feature high-performance CPU/GPU compute with integrated AI acceleration for critical applications that demand high-speed processing, and computer vision,” explains Gerhard Edi, CTO at congatec.

The 11th Gen Intel Core processors boost CPU performance boost, have a fast DDR4 memory, expansive PCIe Gen4 and USB 4.0 bandwidth. There are also features that are critical for communication-connected edge computers, says congatec, such as support for hypervisor technologies.

The energy-efficient package leverages Intel’s SuperFin technology for power savings, physical density and providing even more compute power for given thermal envelopes.

The choice of COM Express or COM-HPC allows engineers to choose what is appropriate for the application. For example, says cognate, the COM Express has an improved connector design, which is expected to offer better bandwidth capacities compared to what was previously available. Engineers can consider using high bandwidth interfaces such as PCIe Gen 4.

COM-HPC has more high-speed interfaces delivered over 800 signal pins in total – nearly twice as many as COM Express Type 6 modules deliver with 440 pins, explains Andreas Bergbauer, product line manager at congatec.

The COM-HPC Client size A module (conga-HPC/cTLU) and  the COM Express Compact (conga-TC570) modules will be available with the 11th Gen Intel Core processors. Both modules are the first to support PCIe x4 in Gen 4 quality to connect external peripherals with massive bandwidth. Designers can leverage 8x PCIe Gen 3.0 x1 lanes.

The COM-HPC module offers two USB 4.0, two USB 3.2 Gen 2 and eight USB 2.0 ports, the COM Express module offers four USB 3.2 Gen 2 and eight USB 2.0 in compliance to the PICMG specification.

Sound is provided via I2S, SoundWire by COM-HPC, and HDA by COM Express modules.

Board support packages are provided for all leading OS’s like Linux, Windows and Chrome, as well as hypervisor support from Real‑Time Systems.

congatec provides engineering support and is creating a COM Express and COM-HPC design decision guide and a white paper, available via the company’s website.

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