Contactless payments module is sustainable package
Contactless payment innovations from Infineon Technologies contribute to a more sustainable use of resources with a single source that can be adapted to meet the needs of different projects and markets. The Secora Pay with Coil on Module (CoM) package includes an antenna specifically designed for cards made from recycled ocean-bound plastic or wood. It is the industry-wide thinnest payment module with a copper wire antenna, says Infineon, which allows cost-efficient card manufacturing for mass deployment.
“Infineon’s Coil on Module technology is one of the most important innovations for contactless and dual interface payment cards,” said Bjoern Scharfen, head of products at Payment & Ticketing Solutions at Infineon. Communication between chip module and card antenna is based on a radio frequency (RF) link, with no electrical connection required. “By using CoM, our chip solutions can be easily integrated into contactless cards made of different materials. Manufacturers can flexibly and cost-effectively change their card designs and offer consumers sustainable, long-lasting products,” explained Scharfen.
Secora Pay is already used by CPI Card Group, a payment technology company and provider of credit, debit and prepaid solutions. It uses the package in its new range of eco-friendly plastic cards. The Second Wave payment card features a core made of recovered ocean-bound plastic. “The combination of inductive coupling antennas and chips made scaling this sustainable eco-focused payment card an efficient process”, said Guy DiMaggio from CPI.
Environmentally friendly materials such as wood, polylactid (PLA) or recycled plastic are more challenging to work with compared to PVC, especially when it comes to the card manufacturing processes such as lamination and printing. Infineon’s Secora Pay uses inductive coupling to connect the chip module with the card antenna. As a result, the payment chip modules are just 0.32mm thick, which is up to 50 per cent thinner and up to 70 per cent lighter compared to other solutions available in the market, reports Infineon. The CoM package can be used with many types of card construction and the new, copper wire antenna design is easier to embed into all known inlay sheet materials including recycled ocean-bound plastic, says Infineon. There is also no need for additional adhesive elements during the card lamination process.
Finally, CoM technology makes cards more robust and helps to meet the increasing demand for contactless solutions. Using the CoM, contactless cards can be produced on standard equipment for contact-based cards without making new investments in specific machinery.
