DaVinci Micro test socket reduces crosstalk issues in high speed tests
Smiths Interconnect has added to its DaVinci product line with the DaVinci Micro test socket, designed for high speed testing of 0.35mm minimum pitches.
It was developed in response to requests for increased functionality in the smallest possible footprints. There are many reasons for this. One is the rapid expansion of connected devices and data-intensive applications is driving demand for efficient and adaptive high performance computing (HPC). Another is the fact that mobile devices such as cell phones, tablets and car infotainment systems have sophisticated SoCs which combine CPU, GPU, AI engine, camera processor, memory, and 5G modem in small form factors.
The quest for increased functionality in the smallest possible footprint has led to a reduction of the pitch of ICs below 500 micron. At the same time, increased performances in SoCs affect pin-to-pin noise, known as crosstalk, during testing.
Despite great efforts to improve packet design, the reduction in size inevitably leaves critical high-speed signal lines susceptible to crosstalk, causing false failures during testing.
Smiths Interconnect’s DaVinci Micro test socket leverages the DaVinci coaxial technology for IC applications to 350 micron pitch to provide pin-to-pin isolation, negating the effect of crosstalk during test, and substantially improving the accuracy of chip performance testing, claimed the company. The design protects the small diameter signal probes and ensures that the product can be deployed and withstand the rigours of a production test environment.
“The addition of DaVinci Micro high-speed test socket will enable Smiths Interconnect to offer a solution that can significantly accelerate our customers’ innovation in high performance computing, graphics and adaptive SoCs technologies.” said Brian Mitchell, vice president and general manager of the semiconductor test business unit at Smiths Interconnect. The fully shielded signal path of DaVinci Micro eliminates the negative effects of cross-talk during testing, he added.
Smiths Interconnect provides electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defence, space, medical, rail, semiconductor test, and industrial market segments.
Smiths Interconnect is part of Smiths Group. Smiths serves customers in four major global markets – energy, general industry, security and defence and aerospace.