Distribution agreement bring Octavo Systems’ SiP technology to Avnet Silica
Following the signing of a distribution agreement with Octavo Systems, Avnet Silica offers Xilinx OSDZU3 modules on an exclusive basis, together with access to Octavo’s system in package (SiP) technology.
Employing standardised SiP devices in electronic designs across a wide variety of different applications can simplify the design and development process and speed the time to market, said Avenet Silica. Benefits include a “significant reduction” in board real estate and bill of materials (BoM) cost and a simplified supply chain with the number of discrete parts decreasing from as many as 150 components down to a single device.
The Xilinx-based OSDZU3 SiP family from Octavo includes Xilinx’s single package XCZU3 Zynq Ultrascale+ MPSoC, which integrates a ZU3 multiprocessor, plus up to 16Gbyte of LPDDR4 memory and power management circuitry. The level of integration means it takes up less than half the space of a discrete device and provides fast access to I/O and the ability to take advantage of all the power modes of the ZU3.
The distribution agreement also provides access to other advanced SiP devices across the Octavo portfolio.
“Access to Octavo’s innovative solutions will enable our customers to take advantage of significant savings in the product development process, in their supply chains and their overall total cost of ownership,” commented Lucio Fornuto, director Demand Creation EMEA at Avnet Silica.
Avnet Silica is the European semiconductor specialist division of technology distributor, Avnet and says it acts as the smart connection between customers and suppliers with creative solutions, technology and logistics support. Avnet Silica is a partner of leading semiconductor manufacturers and has a team of more than 200 application engineers and technical specialists to support projects from concept to production.
Avnet Silica is a regional business unit of Avnet, with European headquarters in Belgium.
