Elma Electronic adds to SOSA-aligned backplanes that enable signal processing in rugged applications
Elma Electronic has added six high-speed backplanes that align with The Open Group Sensor Open Systems Architecture (SOSA) Technical Standard 1.0 and incorporate the latest optical fibre and RF connectivity. With two-, four- and six-slot options, the expanded 3U OpenVPX series of backplanes provides development options to meet the demands of rugged military operations.
Designed to help accelerate the development of a common, modular architecture across critical C5ISR and EW systems, Elma’s line of SOSA-aligned backplanes supports the Modular Open Systems Approach (MOSA) standardisation initiative from the US Department of Defense (DoD). The series incorporates current Ethernet and PCI Express standards as well as optimising SWaP and lowering lifecycle costs for rapid technology insertion.
Dave Caserza, manager, embedded computing architects for Elma Electronic, commented, “As military embedded computing moves towards adoption of systems implemented using the SOSA architecture, having access to the right tools will be critical for design engineers to quickly bring systems to market. Expanding our offerings of integral system components, like these new high-speed backplanes aligned with SOSA, is just part of Elma’s commitment to providing industry-leading open standards technologies.”
The new backplanes support up to 100GBase-KR4 and PCIe gen 4 high-speed signals on all applicable data paths. One of the six-slot models also supports VITA 66.5 optical connectors for the Ethernet switch slot.
Several high-performance mission-critical systems can benefit from these new backplanes, including mission control, sensor-based systems, surveillance, radar and other beamforming applications as well as weapons control, target tracking and display, navigational control, threat detection and process and environmental monitoring.
Elma Electronic is a manufacturer of commercial, industrial and rugged electronic products for embedded systems and application-ready platforms – from components, embedded boards, backplanes, chassis and enclosures, power supplies, to fully integrated subsystems.
