Extended range platforms tackle ruggedization challenges

Ruggedisation challenges are the focus for congatec at Embedded World 2021 where it will be presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. The driving force behind this focus is the demand for rugged edge and real-time fog computing technologies for digitisation projects in often harsh and challenging environments.

The new platforms support extreme temperature ranges from -40 degrees C to +85 degrees C, feature ball grid array soldered shock and vibration, as well as high EMI resistance. They can be made available with conformal coating to protect the platforms against ingress from condensation, salt water and dust.

Typical uses for these platforms can be found in critical railway, road traffic and smart city infrastructures, offshore rigs and wind parks, electricity distribution networks, piping systems for the oil, gas and freshwater industries, telecom and broadcasting networks, as well as distributed surveillance and security systems.

Presentation highlights include congatec’s high-end x86 computer-on-modules based on the COM-HPC and COM Express standards. The conga-HPC/cTLU COM-HPC client size A modules and the conga-TC570 COM express compact modules are available with scalable 11th generation Intel core processors for temperatures ranging from -4 degrees C to +8 degrees C. Both modules support PCIe x4 in generation 4 performance to connect peripherals with massive bandwidth.

Rugged platforms with extended temperature options from -40 degrees C to +85 degrees C on the basis of Intel Atom x6000E series, Intel Celeron and Pentium N & J Series processors are available as computer-on-modules in the SMARC, Qseven, COM Express Compact and Mini form factors, and also as Pico-ITX single board computers. Suitable for real-time industrial markets, they offer time sensitive networking Intel time co-ordinated computing, hypervisor support from real time systems and BIOS configurable ECC.

The new SMARC 2.1 computer-on-module with i.MX 8M plus processor will also be on show. Consuming 2-6W, this low power embedded and edge computing platform for extended temperature ranges offers two or four Arm Cortex-A53 processor cores and an additional neural processing unit, which adds up to 2.3 TOPS of AI computing power. Designed for AI inferencing and machine learning at the edge, the modules are optimised for processing and analysing dual-camera image signal processor data received via the two integrated MIPI-CSI interfaces.

Embedded World Digital 2021, a virtual event, runs from March 1 to 5 2021.


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