Farnell ships Nexperia SiGe rectifiers from stock
Farnell is now shipping SiGe rectifiers from Nexperia. The SiGe rectifiers come with 120 V, 150 V, and 200 V reverse voltages that combine the high efficiency of their Schottky Diode counterparts with the thermal stability of fast recovery diodes.
Targeting automotive, communications infrastructure and server markets, the 1-3 A SiGe rectifiers benefit high ambient temperature applications such as LED lighting, engine control units or fuel injection systems.
Design engineers using these low leakage devices can work with an extended safe-operating area with no thermal runaway up to 175 degrees C. At the same time, they can optimise their design for higher efficiency which is not feasible using fast recovery diodes commonly used in such high-temperature designs. By boosting a low forward voltage (Vf) and low Qrr, the SiGe rectifiers have an advantage of 10 to 20 per cent lower conduction losses, says Farnell.
The Nexperia SiGe rectifiers are housed in industry standard rugged CFP3 and CFP5 packages. Other features include solid copper clip for high thermal performance and power dissipation; pin-to-pin replacement with Schottky Diodes and fast recovery rectifiers and reduced package inductance for improved switching behaviour and less parasitic capacitance in the circuit.
SiGe complements Nexperia’s power diodes range, which includes more than 100 Schottky Diodes and fast recovery rectifiers in the CFP package. Farnell stocks 12 different products within the SiGe rectifier family from Nexperia. The AEC-Q101 compliant rectifiers are available with repetitive reverse voltage Vrrm Max of 120 V, 150 V and 200 V options and the forward current IF (AV) of 1, 2 or 3 A.
Lee Turner, global head of semiconductors and single board computing, at Farnell said: “Designers are under constant pressure to deliver more performance from less space with new applications requiring the highest system efficiency and greatest system miniaturisation. It is essential that we provide our customers with market-leading solutions that offer the best efficiency, ease of thermal design and a small form factor to support critical applications in the automotive, server and communications markets.”
For more information go to https://uk.farnell.com
