Flash memory from Cypress prepares for automotive and industrial safety

Claimed to deliver the industry’s best combination of safety and reliability for automotive and industrial applications, the Semper NOR flash memory is the first memory that is architected and designed to meet the automotive industry’s ISO 26262 functional safety standard for building fail-safe embedded automotive systems, says Cypress.

The family is automotive-qualified, ASIL-B functional safety compliant, and provides endurance and data retention at the extreme temperatures common in automotive and industrial applications, adds the company.

Cypress’ EnduraFlex architecture simplifies system design by enabling a Semper Flash device to be divided into multiple partitions, independently optimised for high endurance or long retention. For frequent data writes, a partition can be configured to deliver up to 1.28 million program-erase cycles for 512Mbit density parts and 2.56 million cycles for 1Gbit parts. For code and configuration storage, a partition can be configured to retain data for 25 years.

The Semper Flash family includes AEC-Q100 automotive-qualified devices with an extended temperature range of -40 to +125 degree C, supports 1.8 and 3.0V operating ranges, and is available in densities of 512Mbit through 4Gbit. The devices are offered with quad serial peripheral interface (SPI), octal SPI and HyperBus interfaces. The Octal and HyperBus interface devices are compliant with the JEDEC eXpanded SPI (xSPI) standard for high-speed x8 serial NOR Flash and offer read bandwidth of 400Mbyte per second.

NXP has paired its MCUs and SoCs with HyperBus memories to increase capacity. Ray Cornyn, vice president and general manager of vehicle dynamic solutions at NXP welcomes the announcement: “The next-generation Semper NOR Flash family with HyperBus from Cypress provides a strong roadmap for continuing that success as it looks to support future market needs both for safety and robustness,” he said

Cypress’ 512Mbit Semper Flash devices are sampling to lead customers now, with qualified samples available in Q4 2018. Volume production of the devices with 24-ball BGA, 16-pin SOIC and eight-contact WSON packages is expected in Q1 2019.


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