Flex-rigid laminates is designed for mil-aero and hi-rel applications

Ventec has added tec-speed 4.0 (VT-462(L) PP NF/LF), an FR 4.0 pre-preg material to its flex-rigid No Flow / Low Flow range. It offers high-Tg, low Dk, low loss, and excellent thermal reliability, reported the Chinese materials manufacturer. 

The IPC-4101E compliant material is designed for critical industries such as high-reliability military, aerospace/space. It is suited to harsh environments and all flex-rigid applications with high BPS data rates, high speed, flex-rigid connectors, high frequency and high speed applications, satellite communications, navigation systems and GPS.

Tec-speed 4.0 (VT-462(L) PP NF/LF) brings value to circuits that need mechanical flexibility, said Ventec. Whether formed once to allow installation during product assembly or flexing dynamically with moving parts such as printer heads or optical drives, the material formula withstands reflow temperatures and maintains its structural integrity to prevent fatigue or corrosion, said the company.

With high Tg (175 degrees C), high Td (360 degrees C), and a low Dk of 3.8, VT-462(L) PP NF/LF delivers thermal performance and ease of manufacturing, allowing for better board design for applications which require critical thermal management in harsh environments. 

There is a selection of glass fabric options to choose from, i.e. 1067, 1078, and 1080 with pressed thicknesses from 2.2 to 3.3mil/ply (0.056 to 0.084mm/ply). 

VT-462(L) PP NF/LF is compatible with lead-free assembly processes and meets RoHS and WEEE requirements. It also complies with UL94 V-0.

Ventec has strict manufacturing and supply processes for all its materials, and as such, VT-462(L) PP NF/LF is manufactured using strict, quality-controlled processes that are accredited to AS9100 and IATF quality standards. The company also complies with applicable IPC, space agency and MIL-STD specifications. 

The material is manufactured at Ventec’s facilities in China and Taiwan which are equipped with Ventec’s proprietary multiple-stage filtration systems on the front end and 100 per cent automated optical inspection for pre-preg FOD-control on the back end. 

Ventec designs, develops, manufactures and sells copper clad laminates and prepreg bonding materials for the fabrication of  a wide variety of PCB applications, namely flexible, rigid-flexible and rigid PCBs.

Established in 2000, the company has headquarters and manufacturing facilities in China and Taiwan and service centres across Europe and America.

The company uses equipment from Japan and Taiwan, with specifically designed plant layouts and production flows.

The company is also committed to research and development and has an in-house laboratory which includes lab scale treaters and presses, as well as a full suite of test equipment. In addition to flexible production capacity and competitively priced manufacturing, Ventec says its team of experts is dedicated to providing customers with service and technical support, The company has customers throughout Asia, America and Europe.


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