Furnace tool introduces alloy anneal for IGBT manufacture
Alloy anneal capabilities have been introduced for the Ultra Fn Furnace tool developed by ACM Research. The supplier of wafer processing for semiconductor and advanced wafer level packaging applications has extended its range for power device manufacturers with the introduction of the Ultra Fn Furnace tool. It offers new capabilities that are critical to meet production requirements of insulated gate bipolar transistor (IGBT) devices as transistors get thinner, smaller and faster, explains ACM Research.
Manufacturing requirements for IGBT are increasing as chip technology becomes more advanced. IGBT applications, particularly EVs, require faster switching capabilities, increased power efficiency, and higher power density. As a result, IGBTs must be smaller, faster and thinner.
The Ultra Fn Furnace tool with alloy anneal capabilities is customised to perform anneal processes under protective inert gas, reductive gas conditions or high vacuum conditions down to the micro-Torr level. It has a design in the wafer handling system, process tube and boat and can be applied for thin wafers or taiko wafers. The system is intended for batch processing of up to 100 12-inch (300mm) wafers. The applications of the Ultra Fn system can be extended into the low pressure chemical vapour deposition (LPCVD) process for SIN, HTO, un-doped poly and doped poly deposition, gate oxide deposition process, ultra-high temperature processes up to 1200 degrees C, and atomic layer deposition (ALD).
ACM Research develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes that are critical to advanced semiconductor device manufacturing as well as wafer-level packaging. The company delivers customised, high-performance, cost-effective process solutions for use by semiconductor manufacturers to improve productivity and product yield.