Galileo test socket is low profile for digital and RF projects, says Smiths Interconnect

Developed for area array and peripheral package test, the Galileo test socket has been released by Smiths Inteconnect for rapid device bring up, characterisation and failure analysis.

The low-profile test socket is engineered to support today’s high performance digital and RF applications. It uses interposer elastomer technology and 3D printing manufacturing to test BGA, LGA, QFP, SOIC, or QFN packaged devices with short lead times.

“A good portion of customers have products with critical time-to-market goals. . . . the Galileo test socket provides an accurate, at-speed and cost-competitive test solution,” said Bruce Valentine, vice president and general manager of the semiconductor test business unit at Smiths Interconnect. The socket is named after the Italian physicist and engineer, Galileo who made a significant contribution to speed and velocity studies, Valentine explained.

Based on a “universal” elastomer contact assembly, Galileo supports almost any standard package pinout, on any pitch (or multiple pitches) above 0.35mm, in any configuration, with no extra tooling charges. A single socket can be re-used across multiple pitches and pad / ball placement. No contact alignment or registration holes are required in the PCB, enabling quick and easy board integration, added Smiths.

The Galileo elastomeric test socket features short electrical paths to optimise excellent signal integrity, low inductance and a high bandwidth (above 40GHz), and high thermal conductivity.

The contact set can be replaced in the field, with minimal tooling and little technical expertise is required, reported the company. Pre-stocked elastomer sheets enable short lead times.

Smiths Interconnect provides electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defence, space, medical, rail, semiconductor test, and industrial markets.

Smiths Interconnect is part of Smiths Group, a global technology group delivering products and services for the medical, security and defence, general industrial, energy and space and commercial aerospace sectors worldwide.

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