High density interconnect series is designed and tested for space
Specifically designed and tested for high-speed space applications up to 10Gbits per second, the NXS series of high density interconnect is available from Smiths Interconnect.
As space satellites move away from RF analogue-based payloads providing low-speed telecommunications signalling to a digital transparent processor architecture for high throughput satellites, demands for rugged and higher speed connectivity are increasing.
The NXS forms the interconnect backplane that enables a scalable satellite design using as many or as few modular digital processors as required, while ensuring signal integrity and high resistance to shock, explains Smiths Interconnect.
“Satellite manufacturers often use large singular PCBs featuring very high value components,“ said Mark Kelleher, vice president and general manager of the Connector Business Unit at Smiths Interconnect . “The NXS Series provides them with a solderless PCB mounted connector that can be placed and replaced with very low risk to their board,” he said.
The NXS series has been designed to offer a high density interconnect that is more compact than those currently available in the marketplace, providing next generation data on demand, explained Kelleher.
The NXS series is qualified to the rigorous testing and performance criteria of ESCC 3401, ESCC 3402, ECSS-Q-ST-70C, ECSS-Q-ST-70-02, ECSS-Q-ST-70-08C, ECSS-Q-ST-70-38C and ECSS-Q-70-71.
Equipped with the micro Hypertac Hyperboloid contact technology, the NXS series can withstand data rate application up to 10Gbits per second requirements per channel, including extreme levels of vibration, shock and climatic testing above 2100G.
It is available in a robust design with four or 12 high speed quadrax (dual-twinax) modules. Each high density quadrax module contains two dual twinax at 100 Ohm per pair. It is blind mateable and hot pluggable with low mating forces and low outgassing materials.
The solderless PCB mount design reduces the customer’s risk and cost of ownership, says Smiths. The connector is mounted after reflow and has no impact on nearby components. Each product is engineered using 3D electromagnetic simulation (EM) software for performance in a total thin film process.