High density packaging meets WBG demand, says Kemet
Designed for use by power electronics engineers where high-power density and high efficiency in a small form factor is critical, the Konnekt high-density packaging technology extends Kemet’s KC-Link family.
The Konnekt packaging technology extends the KC-Link range to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors, electric vehicle and hybrid electric vehicles (EVs/HEVs), LLC resonant converters and wireless charging applications. The technology combines KC-Link’s robust and proprietary C0G Base Metal Electrode (BME) dielectric system with Konnekt’s Transient Liquid Phase Sintering (TLPS) material to create a surface mount, multi-chip package which is particularly well-suited for both high-density packaging and high-efficiency applications, says Kemet. It is claimed to produce up to four times the capacitance compared to a single multi-layer ceramic capacitor.
High mechanical robustness allows KC-Link capacitors with Konnekt to be mounted without the use of lead frames. This provides low effective series inductance (ESL), increases the operating frequency range and allows for further miniaturisation, explains Kemet. The series is available in commercial grade with tin termination finish, and is Pb-Free, RoHS- and REACH-compliant. Capacitors using Konnekt technology can be mounted in a low-loss orientation to increase their power handling capability further, Kemet adds.
Combining the company’s Class 1 C0G dielectric system with Konnekt technology offers a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. Designed for an operating temperature range up to 150 degrees C, the capacitor can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. The components are positioned for growth within the DC/DC converter market in aerospace, medical and automotive applications.
“The low ESR of KC-Link capacitors results in best-in-class ripple current capability,” said Dr John Bultitude, Kemet vice president and technical fellow. “Combined with Konnekt technology, this solution delivers thermal stability and mechanical robustness through increased efficiency by combining multiple capacitors into a single high density, ultra-low loss package,” he said.
The KC-Link with Konnekt technology is available immediately via Kemet distributors.
