Hybrid processors use 3D packaging to drive innovation
Intel Core processors with Intel Hybrid Technology, code-named Lakefield, leverage Intel’s Foveros 3D packaging technology and feature a hybrid CPU architecture for power and performance scalability. The Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility, says Intel and are designed for light, innovative form factors.
They hold the promise for innovation in mobile computing, says the company. “Intel Core processors with Intel Hybrid Technology are the touchstone of Intel’s vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs,” said Chris Walker, Intel corporate vice president and general manager of mobile client platforms. “Combined with Intel’s deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future,” he added.
Intel Core processors with Intel Hybrid Technology deliver full Windows 10 application compatibility in up to a 56 per cent smaller package area for up to 47 per cent smaller board size and extended battery life, says Intel. This offers OEMs more flexibility in form factor design across single, dual and foldable screen devices without compromising the PC experience, said the company.
They are the first Intel processors to feature native dual internal display pipes, making them particularly suitable for foldable and dual-screen PCs.
They are also the first Intel Core processors to ship with attached package-on-package (PoP) memory, which further reduces board size. They are the first Intel Core processors to deliver as little as 2.5mW of standby SoC power. This is a reduction of up to 91 per cent compared to Y-series processors and allows more time between charges.
The Intel Core processors with Intel Hybrid Technology have been used in the co-engineering Lenovo ThinkPad X1 Fold. This fully functional PC with a folding OLED was unveiled at CES 2020 and is expected to ship this year. The processors and technology have also be used in the Samsung Galaxy Book S, which is expected in select markets from June 2020.