Hybrid thermal and EMI material delivers 5G protection
Laird Performance Materials has developed a hybrid thermal and EMI absorber material that supports 5G handheld device and network infrastructure applications.
CoolZorb 5G is specifically designed for the millimeter wave (mmWave) and microwave frequencies that 5G will implement, explains Laird. The multi-functional CoolZorb 5G serves as a heat-mitigating gap filler and EMI-reducing absorber to optimise 5G system performance.
CoolZorb 5G is used like a traditional thermal interface material between heat source, such as an IC and heat sink or other heat transfer device or metal chassis. It is a thermal conductor for heat dissipation and suppresses unwanted energy coupling, resonances or surface currents causing board level EMI issues. By addressing both EMI and heat challenges, CoolZorb 5G enables engineers to shorten the design cycle and move their 5G products to market faster, claims Laird.
“With 5G it is almost impossible to design around protective components like absorbers, which increase in effectiveness at higher frequencies and can help address heat sink-generated EMI issues at mmWave,” said Paul F. Dixon, material scientist at Laird Performance Materials. “While there is no one-size-fits-all solution to EMI and heat challenges in 5G technology, multi-functional products like the CoolZorb 5G allow engineers to address EMI and heat issues simultaneously and save space within devices,” he adds
The CoolZorb 5G hybrid thermal & EMI absorber material is available in standard sheet sizes of 18 x 18-inch (457 x 457mm), in thicknesses ranging from 0.040 to 0.200-inch (1.0 to 5.1mm).
Laird Performance Materials boasts advances in material sciences to suppress, block or absorb disruptive electromagnetic interference (EMI) or transfer unwanted heat away from sensitive components. Custom-engineered precision and structural metal parts provide solutions to complex and challenging device designs.