IGBT7 modules with Trenchstop chip offer increased inverter output
EcononDual 3 packaging was selected by Infineon for the Trenchstop 1700V IGBT7 chip. As a result, the FF900R17ME7_B11 provides 900 and 750A current in a standard industrial package increases the power density of an inverter and enables an improved power range for inverters, said Infineon. The FF900R17ME7_B11, FF750R17ME7D_B11 and FF225R17ME7_B11 modules target a wide range of applications including wind, drive and static VAR (reactive power) generators (SVG).
Compared to modules using the IGBT4 chipset, the IGBT7 enables up to 40 per cent higher inverter output current in the same package size. The 1700V IGBT7 modules also feature “significantly lower” static and dynamic losses and addresses applications with prevailing static losses in diode chips. The chip technology offers enhanced du/dt controllability and improved diode softness, added Infineon. Induced by cosmic rays, the FIT (failure in time) rate has also been improved to optimise working with high DC link voltage. Maximum overload junction temperature is 175 degrees C.
The FF900R17ME7_B11, FF750R17ME7D_B11 and FF225R17ME7_B11 can be ordered now. Current classes from 300 to 750A will follow at the end of 2022.
At PCIM Europe 2022 (10-12 May, in Nuremberg, Germany), Aleksei Gurvich, senior manager of product definition and application engineering will present a paper about the 900 and 750A 1700V EconoDUAL 3 modules with Trenchstop IGBT7.
Personnel from the company will present at the PCIM Conference and Industry and E-Mobility Forum with live and on-demand video presentations, followed by discussions with the speakers.
