Infineon claims to offer first industrial-grade eSIM in miniature package
To take advantage of mobile networks in machine to machine (M2M) and the IoT, Infineon Technologies has introduced what it claims is the world’s first industrial-grade embedded SIM (eSIM) in a miniature wafer-level chip-scale package (WLCSP). It is designed for manufacturers of industrial machines and equipment, from vending machines to remote sensors to asset trackers.
Deploying eSIM brings a number of advantages for a smooth adoption of cellular connectivity into industrial environments, maintains Infineon. Device manufacturers can increase design flexibility due to the eSIM’s small footprint. It can also be used to simplify manufacturing processes and distribution thanks to a single stock-keeping unit. Customers also have the possibility to change their mobile service provider at any time, for example, if the quality of the network deteriorates or in the event of a better contract from the mobile operator.
The SLM 97 security controller in a WLCSP measures just 2.5 x 2.7mm and supports an extended temperature range of -40 to 105 degrees C. Its feature set complies with the latest GSMA specifications for eSIM.
The SLM 97 security chip is manufactured at Infineon’s production site in Dresden and Regensburg and is available now in volume quantities.