Infineon highlights power packs for electrification of vehicles
Power modules for xEV main inverters will be presented by Infineon Technologies (Hall 9-313).
The four HybridPack Drive modules are optimised for different inverter performance levels between 100 and 200kW. Infineon is also introducing the HybridPack Double Sided Cooling (DSC) S2, a technology upgrade to the existing HybridPACK DSC. This module targets main inverters up to 80kW in hybrid and plug-in hybrid electric vehicles (HEVs) with high power density requirements.
The new models have the same footprint as the existing FS820R08A6P2x), which will allow system developers to scale inverter performance quickly and without a major system redesign.
The family includes the HybridPack Drive Flat (FS660R08A6P2Fx) and Wave (FS770R08A6P2x) modules. These are cost-optimised for 100 up to 150kW inverters respectively. Baseplates connect to the cooler of the inverter and have different structures providing different capabilities of thermal dissipation. While the PinFin baseplate offers the highest cooling performance, the Flat version uses a flat baseplate for a lower power output at lower cost. The Wave version fills the performance gap between the Flat and PinFin derivatives with a Ribbon Bond baseplate structure.
The FS950R08A6P2B power module targets 200kW inverters. It is equipped with a PinFin baseplate but with a ceramic material instead of the conventional aluminum oxide to improve cooling by more than 20 per cent, says Infineon, to enable higher current capabilities.
The Flat, Wave and Performance modules have the company’s EDT2 (Electric Drive Train) IGBT generation.
The fourth new device (FS380R12A6T4x) is an alternative version of the Performance module, targeting 150kW inverters. It includes the same PinFin baseplate and performance ceramic, with a different chipset of IGBT4 dies, making it the first derivative with a 1200V blocking voltage. This characteristic will be necessary in electric vehicles (EVs) with a battery voltage of more than 700V for fast charging. For switching frequencies in the range of 8kHz, the IGBT4 thus represents a less expensive alternative to SiC modules, says Infineon.
Infineon will now also equip the HybridPACK DSC module with EDT2 technology (HybridPACK DSC S2, FF450R08A03P2). The chipset with a 750V blocking voltage shows benchmark current density, short circuit ruggedness and light load power losses. The DSC S2 module uses the proven double-sided cooling package concept and provides an extended short-term operating capability up to a chip junction temperature of 175 degrees C.
The chip technology upgrade and the higher chip temperature operating capability lead to a 40 per cent increase in the achievable performance from the same footprint compared to the existing HybridPACK DSC S1. This leads to a very high power density, which helps system developers to meet the tight space requirements in hybrid and plug-in hybrid vehicles.
As a compact half-bridge module, the HybridPACK DSC enables different inverter geometries and further motor integration. The on-chip current and temperature sensors contribute to an efficient and safe inverter operation.
The new HybridPACK Drive products will be available in June 2019, the HybridPACK DSC S2 will be available in July 2019.