Infineon launches flip-chip regulator for automotive use
Infineon has established a dedicated production process for flip-chip packages and has introduced the first produce for the automotive market, the OptiReg TLS715B0NAV50. Flip-chip technology means that the ICs are installed upside down in the package. With the heated part of the IC facing the bottom of the package and being closer to the PCB, thermal inductance can be improved by a factor between two and three, says Infineon. The higher power density enables a “significantly smaller footprint” than conventional package technologies, claims the company.
The linear voltage regulator in a TSNP-7-8 package measures 2.0 x 2.0mm, which is over 60 per cent smaller than that of an established reference product (TSON-10 package, at 3.3 x 3.3mm, says Infineon, yet thermal resistance stays the same. The OptiReg TLS715B0NAV50 is suitable for applications with very limited board space, such as radar and cameras. It provides 5V with a maximum output current capability of 150mA.
Flip-chip technology is used in a growing number of radar and camera systems and automotive electronics which require smaller, but high quality power supplies, prompting Infineon to create its dedicated production process for automotive devices rather than rely on a subsequent qualification of existing consumer and industrial products. Infineon says that it will apply the flip-chip technology to future switch mode voltage regulators and power management ICs (PMICs).
The OptiReg TLS715B0NAV50 is available now.
