Integrated eMMC simplifies design, says Alliance Memory
eMMC devices that integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single package have been designed by Alliance Memory for solid-state storage in consumer, industrial, and networking applications. In addition to fast and easy system integration, speeding up product development and time to market, they also save space by eliminating the need for an external controller. They are compliant with the JEDEC eMMC v5.1 industry standard and available with densities of four and 8Gbyte. A 16Gbyte device will be released in December 2022.
The company will highlight the eMMC products at electronica 2022 in Munich. There will also be new “A” die versions of Alliance Memory’s original 4Gbyte DDR4 SDRAMs built on a finer process that results in a smaller chip than the company’s original 4Gbyte DDR4 SDRAMs. They also have lower power consumption down to +1.2V (±0.06V), faster clock speeds to 1600MHz, and higher transfer rates to 3200Mbits per second and are provided at a lower cost. They are intended for the industrial, networking, telecommunications, gaming, and consumer markets, for which Alliance Memory is using a dual sourcing strategy to ensure supply longevity. The company also offers a 16Gbyte Micron Technology DDR4 SDRAM for a wide range of applications.
The company also offers 3.0 and 1.8V multiple I/O serial NOR flash memory products, which are designed to provide supply continuity to Micron Technology customers using discontinued devices. The NOR flash products combine fast read performance up to 133MHz with fast program and erase times. Available in eight-pin SOP wide body (208mils) and 8L WSON (6x5mm) packages with densities of 64 and 128Mbit, the devices provide reliable, long-term performance with high program/erase cycles and long data retention, said Alliance Memory.
Other products available include DDR3 (1.5V) and DDR3L (1.35V) SDRAMs, which includes 512Mbit, 1Gbit, 2Gbit, 4Gbit and 8Gbit devices in x8/x16 bus widths, offered in 78-ball and 96-ball FBGA packages across commercial, industrial, and automotive temperature ranges. These devices offer a double data rate architecture for extremely fast transfer rates of up to 2133Mbits per second per pin and clock rates of 1066MHz, the devices provide reliable drop-in, pin-for-pin compatible replacements for a number of similar solutions used in conjunction with newer-generation microprocessors for industrial, medical, networking, consumer, telecomms, aerospace and automotive applications.
Alliance Memory’s stand will be in Hall C3-328 at electronica (15 to 18 November).
