Intelligent power modules save space for vehicle on-board charging
Automotive intelligent power modules (IPMs) are claimed to offer class-leading power density and improve overall performance in on-board charging (OBC) and other high-voltage DC/DC conversion applications for electric vehicles (EVs) and plug-in hybrid electric vehicles (PHEVs).
The FAM65xxx APM16-packaged devices ease design-in for automotive customers with one device outline covering H-bridge, power factor correction (PFC) and bridge rectifier configurations to address applications at each OBC and DC/DC stage.
The FAM65xxxx modules can save approximately 50 per cent board space and significantly ease manufacturability versus discrete component based solutions, according to ON Semiconductor. Their small size and weight, combined with high efficiency levels, can “dramatically improve” power density and system efficiency, contributing to reduced fuel consumption and CO2 emissions for vehicles, says the company.
Lower EMI has been reached due to an integrated high voltage capacitor. The IPMs have an internal direct bonded copper (DBC) structure that is fully isolated to 5kV AC per second. ON Semiconductor explains that this makes them easier to use as there is no need for insulation sheets. They also comply with the latest, most stringent automotive qualifications, AECQ 101 and AQG324, says ON Semiconductor.
ON Semiconductor will be exhibiting at electronica (13 to 16 November) and visitors to its booth (Hall C4-101) can see these FAM65xxxx modules alongside autonomous driving and lighting technology.
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