Leadless NTC thermistor dies have mounting choices

Leadless NTC thermistor dies have been developed by Vishay Intertechnology with silver metallisation to support different mounting options, to provide designers with more choice. 

The Vishay BCcomponents NTCC201E4 have contacts on the top and bottom and have high resistance to leaching, formic acid etching and forming gases. They support aluminium wire bonding and are compatible with reflow soldering under vacuum or with formic acid / forming gases, SAC (tin, silver, copper) or surface mount package soldering and nano-silver paste sintering. 

Operating over a wide temperature range from -55 to +175 degrees C, the AEC-Q200 qualified devices released today are optimised for temperature sensing, control, and compensation in automotive and alternative energy applications. End products will include IGBT and power MOSFET modules and power inverters for electric (EV) and hybrid electric vehicles (HEV), solar panels and wind turbines. 

The top and bottom metallisation of the NTCC201E4 thermistors has two layers. An external layer offers superior resistance to soldering leaching compared to previous-generation devices, said Vishay, especially when using high melting point solder materials at temperatures to +360 degrees C. An internal layer resists board formic acid etching when solder preforms are used and forming H2 / N2 gasses. 

RoHS-compliant, halogen-free, and Vishay Green, the thermistors offer resistance at +25 degrees C (R25) from 4.7 to 20 kOhm, with tolerance down to ± one per cent and beta (B25/85) from 3435 to 3865K, with tolerance down to ± one per cent. The devices feature maximum power dissipation of 50mW, response times of three seconds and are packaged in PS blister tape. 

Samples and production quantities of the NTCC201E4 series are available now, with a lead time of 20 weeks. 

Vishay manufactures discrete semiconductors and passive electronic components used in the automotive, industrial, computing, consumer, telecommunications, military, aerospace and medical markets. 


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