LG G8ThinQ has Real3 image sensor chip for front-facing ToF camera
LG Electronics and Infineon Technologies have teamed up to introduce time of flight (ToF) technology to smartphones.
At MWC19 in Barcelona, later this month, LG will unveil its G8 ThinQ, with Infineon’s Real3 image sensor chip in the front-facing camera.
Building upon the combined expertise of Infineon and pmdtechnologies in algorithms for processed 3D point clouds (a set of data points in space produced by 3D scanning), the sensor promises to deliver a new level of front camera capability in a smartphone for the selfie-generation.
While other 3D technologies use complex algorithms to calculate an object’s distance from the camera lens, the ToF image sensor chip delivers more accurate measurements by capturing infra red light as it is reflected off the subject. As a result, ToF is faster and more effective in ambient light, reducing the workload on the application processor, also reducing power consumption.
Its fast response speed means that ToF technology is widely used in biometric authentication methods, such as face-recognition. As ToF sees objects in 3D and is not affected by light from external sources, it delivers an excellent recognition rate, both indoors and out, ideal for implementation in augmented reality (AR) and virtual reality (VR) applications, continues Infineon.
The company developed the ToF technology featured in the LG G8 ThinQ for use in both premium, high-end smartphones as well as mid-end devices.
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