Memphis supplies 8Gbit DDR3 components from Intelligent Memory.
Hong Kong based I’M Intelligent Memory has revised its 8Gbit DDR3L components, just before the end of life phase begins at Hynix/Samsung for similar devices.
The fabless DRAM supplier points out that DDR3 memory technology is widely used in the industry. While many DRAM manufacturers offer the components in capacities of one to 4Gbit, the high-capacity 8Gbit components have conventionally been limited to large companies. The largest DRAM manufacturers Samsung and Hynix have both announced end-of-life for their DDR3 8Gbit devices, leaving many industrial customers with no supply, says Intelligent Memory.
The Samsung and Hynix compatible 8Gbit DDR3 components can be ordered from Intelligent Memory. There are two options available, a 1Gx8 configuration in FBGA 78 ball package and x16 (512Mx16) type in FBGA 96 ball package. Dimensions are 9.0 x 10.6mm for the FBGA78 and 9.0 x 13.5mm for the FBGA96 package, the devices are small enough to fit on a majority of existing layouts, adds the company.
Hynix and Samsung both only supported 8Gbit dual die package (DPP) components having two separate chip-select lines. I’M offers their 8Gbit DDR3 components optionally with a single chip select (1CS) or a dual chip select (2CS) pinout.
Applications where the board-layout is prepared with a single CS line to each DDR3-component were often limited to a maximum 4Gbit devices. The Intelligent Memory 8Gbit 1CS products now deliver the upgrade-path to double the capacity.
8Gbit DDR3 devices are also used on most high capacity memory modules for servers with form factors such as RDIMM, VLP RDIMM, LRDIMM, VLP Mini RDIMM or VLP Mini UDIMM.
Samsung and Hynix also announced end of life of their complete line of DDR3 modules, and even third party manufacturers such as Smart, Virtium, Viking, ATP, will be affected by the 8Gbit end of life.
Intelligent Memory has its own memory-module manufacturing line together with its own DRAM-line including 8Gbit DDR3, they will also be offering almost the complete line of DDR3 modules in all form-factors with longevity for multiple years.
For SO-DIMM and UDIMM memory-modules, I’M Intelligent Memory offers capacities up to 16Gbyte per single module, optionally with ECC.
Joseph Chan, general manager of I’M Intelligent Memory confirms that the company is already working on a 16Gbit 2CS device, “as we had many customer-requests for such product”. He adds: “We plan to have the 16Gbit DDR3 parts ready by Q3/2018 and we will be offering them in three different widths, x8, x16 and also a x32.” For the x32 the company will use a BGA136 ball package.
All of the I’M DDR3 devices support DDR3L low-voltage (1.35V) operation and fully backward-compatible to standard DDR3 1.5V operation. The products are optionally available in commercial as well as industrial temperature ranges.
