Micro power connectors increase amperage and free space

Offering design flexibility for power-only or power/signal applications, mPower connectors from Samtec are a 2.0mm pitch power connector system (ultra micro power terminal/ ultra micro power socket or UMPT/UMPS).

The connector systems has a small form factor while achieving up to 18A per blade. As well as saving board space, it carries high amperage per square inch. Compared to traditional power connectors that carry 20A per blade in a large form factor, mPower passes 18A per blade in about half the size, freeing up the board for other components or minimising package size, explains Samtec.

There is a variety of stack heights available, allowsing mPower to be easily added to new or existing architectures alongside one of Samtec’s high-speed connector systems for a two-piece power and signal/ground solution. Stack heights range from 5.0 to 12mm. A stack height of up to 16mm is in development for increased compatibility with other high-speed connector systems. Compatible Samtec high-speed systems include AcceleRate HD, Edge Rate, SEARAY, SEARAY 0.80 mm, LP Array, Q Strip, Q2 and Tiger Eye.

There is also a choice of two, three, four and five power blades, and up to 10 blades is in development). Matte Tin or 10 micro inch gold plating are standard with optional 30 micro inch gold plating to meet specific regulations. The power blades have two stage mating and can be selectively loaded to achieve any specific creepage and clearance requirements. Optional weld tabs provide increased stability on the board.

Other options in development for mPower connectors include a right-angle version with two to 10 position counts and a socket cable assembly to mate with both the vertical and right-angle terminal. The cable assembly will include latching for more rugged applications.

Founded in 1976, Samtec is a privately held manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, precision RF, flexible stacking and micro/rugged components and cables.


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