Micro STX SBC has high-density graphics capability

Designed to provide high-density multi-processor/GPU combinations in graphics intensive applications such as flight and marine training simulators and VR systems, the AsRock MXM-IPC-H110 from BVM uses an MXM graphics module to achieve maximum performance.

The focus on high performance graphics suits the MXM-IPC-H110 to applications where multiple CPUs and graphics engines are networked together to generate large photo-realistic multiple panel displays.

The ASRock MXM-IPC-H110 is a Micro-STX (5.8 x 7.4in) SBC, supporting 7th generation Kaby Lake i7/i5/i3 and Celeron processors combined with the H110 chipset and with up to 32GB 2400MHz DDR4 system memory.

The unit is optimised around the open standard MXM graphics card interface, originally developed by NVidia but supported by others. The IPC-H110 offers five DisplayPorts – one from CPU and four from an external MXM Type B card; an eDP port is also available from the CPU and HexaDisplay multi display is supported.

Two Gigabit Ethernet ports and four USB3.0 ports are provided. Mass storage is enabled through two SATA3 ports and an M.2 Key M expansion port supports a PCIe x 4 port and a SATA3 SSD.

Alternatively a key E M.2 port offers a PCIe x 1 port and a USB2.0 port for wireless interconnect. Power is from an external 19VDC PSU.

This news story is brought to you by softei.com, the specialist site dedicated to delivering information about what’s new in the electronics industry, with daily news updates, new products and industry news.

To stay up-to-date, register to receive our weekly newsletters and keep informed of the latest technology news and new products from around the globe. Simply click this link to register here: softei.com

Readers can also register to receive the monthly newsletter from our sister site, weartechdesign.com. This is the only website dedicated to developers of wearable electronic products. Simply click this link to register: weartechdesign.com