Micro thermoelectric cooler is available in optoelectronic packages

Laird Thermal Systems offers micro thermoelectric coolers which support high temperature applications with compact geometric space constraints. Using the latest thermoelectric materials and advanced ceramic substrates, the OptoTEC MBX series offers micro footprints as small as 1.6 x 1.6mm with thicknesses down to 0.9mm. 

The packing fraction for thermoelectric materials enables high heat pumping densities up to 27W per cm2 at lower operating currents than traditional thermoelectric coolers, claimed Laird Thermal Systems.

The thermoelectric coolers deliver precise temperature stabilisation under changing environmental conditions and are suitable for lidar systems for autonomous vehicles, pluggable optical transceivers for telecomms and indium phosphide VCSELs (vertical-cavity surface-emitting laser) used in high performance applications.

The compact thermoelectric coolers can be used in applications which tend to be highly customised and requiring unique ceramic substrate materials and thicknesses, said Laird Thermal Systems. 

The company offers two solder constructions designed to accommodate reflow temperatures up to 230 or 280 degrees C. Lead attachments are typically wire bondable, LTS offers Au-plated pads or wire bondable posts. Special finishing options are available to incorporate Au-plated patterns on ceramic substrates, pre-tinning of metallised surfaces and attachment of thermistors.

The OptoTEC MBX series is undergoing Telcordia GR-468 Core qualification testing for thermoelectric coolers developed for customer-specific applications to ensure high repeatability and long-life operation in harsh environments. 

Laird Thermal Systems designs, develops and manufactures thermal management solutions for demanding applications across medical, industrial and telecommunications markets. The company manufactures a diverse product portfolio, ranging from active thermoelectric coolers and assemblies to temperature controllers and liquid cooling systems. Its engineers have thermal management expertise, and use advanced thermal modelling and management techniques to solve complex heat and temperature control problems. The company offers a range of design, prototyping and in-house testing capabilities and partners closely with customers across the entire product development lifecycle to reduce risk and accelerate time-to-market. 


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