Modular evaluation kit tests drive options for CoolSiC MOSFETs
Engineers can test different driving options for the 1,200V CoolSiC MOSFETs by Infineon to learn about the power devices’ switching behaviour using double pulse testing.
Infineon offers a modular evaluation platform, comprises of a motherboard, with interchangeable drive cards for the CoolSiC MOSFETs in TO247 thee-pin and four-pin packages. The company hopes that the platform will shorten time to market and facilitate mainstream adoption of silicon carbide (SiC).
The motherboard is split into the primary supply side and the secondary side. The 12V supply and pulse width modulation (PWM) are connected on the primary side while on the secondary side are the secondary supply of the driver, the half bridge with connections for the shunt for current measurement and the external inductance. The positive operating voltage of the drivers can be adjusted between +7.5 and +20V, while the negative voltage can be regulated between +1.0 and -4.5V. The motherboard was designed for a maximum voltage of 800V and a maximum pulsed current of 130A. For measuring at higher temperatures of up to 175 degrees C, the heatsink can be used with a heating element.
The cards can serve as a reference design for two drive options. They feature driver ICs from the EiceDriver family, suitable for high frequency switching of SiC power devices. The first modular card contains the 1EDC Compact 1EDC20I12MH with an integrated active Miller clamp, which is typically activated below 2.0V. The second drive card includes the 1EDC Compact 1EDC60H12AH, allowing a bipolar supply, where VCC2 is +15V and GND2 is negative. With these two driver cards, the portfolio covers a large part of the options preferred by designers for driving SiC MOSFETs, says Infineon. It also confirmed that it will add further variants in “the near future”.
The motherboard, Miller clamp and bipolar drive cards are available to order now. An additional drive card for short circuit detection will be added later this year, followed by a card for surface mount device package testing.