Modules combine Wi-Fi 6/E and Bluetooth 5.4 with LE Audio
Designed to prevent network congestion in industrial applications, the MAYA-W3 is series of compact, dual mode Bluetooth LE 5.4 modules with LE Audio. They also support Wi-Fi 6/E and can be used in healthcare, asset tracking and management, and smart home applications as well as industrial automation and monitoring.
MAYA-W3 is based on Infineon chipsets with a tri-band, dual-band, and single-band variant. The low power AIROCTM CYW55513 Wi-Fi 6/6E and Bluetooth 5.4 chipset goes “beyond the Wi-Fi 6/6E standards to deliver robust connectivity,” said Sivaram Trikutam, vice president of Wi-Fi products at Infineon Technologies. It enables the module to be used in a variety of industrial applications like remote monitoring and control, industrial automation, asset tracking, solar infrastructure and EV charging, he added.
The modules are available in several variants, offering Wi-Fi 6, Wi-Fi 6/E, tri-band, dual-band, and single-band configurations. It can be combined with various antennas, such as antenna pin(s) or U.FL connectors. It is also equipped with an LTE filter to coexist with other technologies.
According to TSR (Techno Systems Research), Wi-Fi 6 adoption is expected to increase steadily, to account for almost 50 per cent of the market by 2028, with IoT devices beginning adoption as early as 2024. The u-blox MAYA-W3 series’ Wi-Fi 6 and the 6GHz performance, alleviate network congestion, claimed u-blox, as well as enhances power efficiency. The modules can operate in temperatures ranging from -40 to +85 degrees C.
The modules measure 10 x 14 x 1.9mm. These are the same dimensions as predecessors to allow for migration.
MAYA-W3 includes Bluetooth LE Audio for point-to-point voice communication and voice broadcasting. All module variants hold global certifications for both Wi-Fi and Bluetooth.
The u-blox technical support team can assist with fast implementation, added the company.
Samples are available now, with volume production scheduled for Q3 2024.