Multi-camera MIPI switch can shrink size of phones and laptops
Measuring just 1.7 x 2.4 x 0.5mm, the P13WVR628 MIPI-compliant switch has been released by Diodes. It can be integrated into product design to reduce the size of product profiles.
The three-lane 2:1 switch supports high speed and low power connections to camera serial interface/display camera interface (CSI/DSI), D-PHY and C-PHY modules. According to Diodes, the industry leading small outline makes the PI3WVR628 suitable for any device that integrates multiple camera modules, such as smart phones, tablets and laptops, as well as displays.
It is intended for consumer devices which are being produced by manufacturers integrating more camera modules, requiring the need for multiplexers designed to work with MIPI modules. The available PCB space, however, remains limited. The small outline of the PI3WVR628 reduces the size of the switch, says Diodes, to meet these new design criteria.
The PI3WVR628 integrates six single-pole double-throw (SPDT) switches with a bandwidth of 6GHz to control three lanes, organised as two data lanes and one clock lane for D-PHY modules and two lanes for C-PHY modules. It also features select and output enable inputs with integrated control logic.
Despite its small size, the PI3WVR628 can support data rates of up to 3.5Gsamples per second for C-PHY-compliant modules and 4.5Gbits per second for D-PHY-compliant modules. The ability to support both formats provides design flexibility, allowing manufacturers to benefit from the PI3WVR628’s small profile when using either interface.
Operating from a supply of between 1.5 and 3.6V, the PI3WVR628 has a quiescent current of 11 microA (typical), falling to a maximum of 1microA when in high impedance mode.
The PI3WVR628 is available now in the 24-X1-LGA2417-24 (XB) package.
Diodes supplies semiconductor products to companies in the consumer electronics, computing, communications, industrial, and automotive markets. Its portfolio includes discrete, analogue and mixed-signal products and leading-edge packaging technology. It offers a range of application-specific products and solutions-focused sales, coupled with worldwide operations of 28 sites, including engineering, testing, manufacturing, and customer service.