NTC thermistor chips can be embedded into power modules
Able to be directly embedded into IGBT modules and used within sintering and AI-heavy wire bonding, a leadless L860 NTC thermistor chip has been released by TDK. The lead-free B57860L0522J500 is designed for a wide temperature range of -55 to +175 degrees and its characteristics correspond to the common MELF-R/T curve with R100 of 493 Ohm. The chip has dimensions of 1.6 x 1.6 x 0.5mm.
According to TDK, unlike conventional SMD NTC chips, the leadless NTC chip is mounted horizontally. For electrical bonding, it has an Ni/Ag thin-film electrode on the bottom for sintering on the direct copper bonded (DCB) board of power modules. The upper electrode comprises a Ni/Au thin film electrode for aluminium wire bonding. Soldering processes are not necessary, confirms TDK.
In contrast to other technologies, the B57860L0522J500 establishes an “outstanding thermal coupling of NTC chips to power modules”, says TDK. This in turn, causes a very short response time and high-precision temperature measurement and control. The efficiency of power modules is typically highest when operating close to their power limits, but to operate at these limits, a precise temperature control is essential. Typical operating temperatures are in the range of 100 degrees C, but may slightly increase to 175 degrees C.
The L860 is suitable for integration into IGBT and IPM modules.
TDK Corporation was established in 1935 to commercialise ferrite, a key material in electronic and magnetic products. TDK’s portfolio features passive components such as ceramic, aluminium electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The company also manufactures sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices and magnetic heads. Products are marketed under the brands TDK, Epcos, InvenSense, Micronas, Tronics and TDK-Lambda.
TDK focuses on the automotive, industrial and consumer electronics and information and communication technology markets. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.
