Rutronik offers small, integrated Bluetooth and RF antenna SiP modules

System in package (SiP) modules from Insight SiP, the ISP1507-AL, are described as one of the smallest, fully integrated devices on the market. The module is for implementing Bluetooth Low Energy and ANT+ RF connections.

Available from Rutronik24, the ISP1507-AL is based on the nRF52810 multiprotocol system on chip (SoC) from Nordic Semiconductor. Its size and levels of integration make it particularly suitable for mesh relay nodes and price-sensitive IoT applications, says the distributor.

Insight SiP is a French technology company that specialises in radio frequency (RF) circuit miniaturisation, SiP technology and antenna in package (AiP) products. The ISP1507-AL use an Arm Cortex M4 floating point processor, which enables it to do fast calculations and manage all 13 I/Os, as well as analogue and digital peripherals. Its small dimensions (it measures 8.0 x 8.0 x 1.0mm), coupled with its range of functions mean the ISP1507-AL BLE module can be used where fast processing and low power consumption is needed. Target applications include IoT, industrial sensors, wearables, beacons, and home automation.

The ISP1507-AL BLE module features 192kbyte flash memory, 24kbyte RAM, and two integrated crystals (32MHZ and 32kHz) to enable high performance operations. In many cases, the ISP1507-AL SiP can eliminate the need for an additional microprocessor or additional memory, says Rutronik.

The SiP also includes an antenna and various interfaces, including SPI, I2C, UART, and ADC.

The ISP1507-AL BLE module supports Bluetooth 5.0, ANT+, and other mesh protocols. The optional NFC antenna allows touch-to-pair functionality.

Nordic’s software stacks can also be used for ISP1507-AL module. In addition, the ISP1507-AL SiP is pin-compatible to the related modules, including the ISP1507-AX and the ISP1807-LR, which will be available in early 2019.

Insight SiP provides turn-key design services and creative packaging for customers who need highly integrated systems to meet the space requirements for wireless and portable devices. The company has expertise in custom multi-die RF circuit miniaturisation, SiP and AiP designs and provides ready-to-use RF modules for Bluetooth Low Energy applications, such as telecoms and mobile computing, portable consumer devices, healthcare, automotive, connected cars, industrial, and the IoT. The company has headquarters in the south of France, and sales offices in the US, Japan, and a worldwide distribution network.

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