onsemi mosfets feature top-cool packaging for automotive market 

onsemi’s new mosfet devices feature top-side cooling to assist designers in challenging automotive applications, especially within motor control and DC/DC conversion, the company claimed.

Housed in a TCPAK57 package measuring just 5x7mm, the top cool devices feature a 16.5mm² thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density. Improved reliability of the new design adds to the system lifetime.

Cooling is one of the greatest challenges in high power design and successfully addressing it is the key enabler to reducing size and weight, which is critical in modern automotive design, said Fabio Necco, vice-president and general manager, automotive power solutions at onsemi. He added that with excellent electrical efficiency and having eliminated the PCB from the thermal path, the design is significantly simplified while reducing size and cost.

The devices deliver the electrical efficiency required in high power applications with RDS(ON) values as low as 1mOhm. Additionally, the gate charge (Qg) is low (65 nC), reducing losses in high-speed switching applications.

According to onsemi, this solution leverages its expertise in packaging to provide the highest power density solution in the industry. The TCPAK57 initial portfolio includes 40.0V, 60.0V and 80.0V. All devices are capable of operating at junction temperatures (Tj) of 175 degree C and are AEC-Q101 qualified and PPAP capable. This, along with their gull wings that allows inspection of solder joints and board level reliability, makes them ideally suited to demanding automotive applications, claimed the company. The target applications are high/medium power motor controls such as electric power steering and oil pumps.

Samples of the new devices are available now with full-scale manufacture planned in January 2023. 

Visit onsemi at electronica 2022, booth 101, hall C4 


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