PCI Express 3.0 packet switch supports 16-lane operation

Offering design flexibility with 16-lane operation which can be two-, three-, four-, five- and eight-port configurations, the PI7C9X3G816GP PCIe 3.0 packet switch has been released by Diodes.

It has been designed to meet advanced performance needs in the networking and telecommunications infrastructure, security systems, fail-over systems, artificial intelligence (AI) and deep learning, network attached storage (NAS), host bus adapter (HBA) cards and data centre applications. It has a wide operating temperature range of -40 to +85 degrees C, making it suitable for a growing number of industrial applications, such as embedded, industrial PC (IPC) and industrial control.

Proprietary architecture in the PI7C9X3G816GP packet switch allows it to be configured to have multiple port / lane width combinations, such as upstream, downstream, and cross domain end point (CDEP), to support fan out and dual host connectivity.

The integrated PCIe 3.0 clock buffer reduces component count, helps to reduce the bill of materials (BoM) and is claimed to ease product design-in. The packet switch supports three reference clock structures: common, separate reference no spread (SRNS), and separate reference independent spread (SRIS). Multiple direct memory access (DMA) channels are embedded into the switch to facilitate efficient communication between the host (or hosts) and connected end points.

Additional features such as error handling, advanced error reporting, end-to-end data protection with error correction, hot plug, and surprise removal enhance reliability, availability and serviceability (RAS), says Diodes.

There is also a built-in thermal sensor which reports operational temperature instantly. Advanced power management means that the PI7C9X3G816GP aligns with the most stringent energy-saving requirements for data centres. For example,  the packet switch supports seven power states to efficiently align with the power requirements and any inactive hot-pluggable ports are kept in a low-power state, explains Diodes. Advanced diagnostic software tools, including PHY Eye, MAC Viewer (embedded LA), and PCIBuddy, assist designers throughout system development.

The PI7C9X3G816GP is supplied in a flip chip package, with 324-ball BGA format.

Dimensions are 19 x 19mm.


Latest News from Softei

This news story is brought to you by softei.com, the specialist site dedicated to delivering information about what’s new in the electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Softei Registration