Phase change thermal conductive material is alternative to pastes
Fischer Elektronik is extending its product portfolio of thermal contact materials with new phase change thermal conductive materials which provide an alternative to the conventional thermal conductive pastes.
The material types combine the advantages of high thermal performance together with the reliability of phase change materials and with a simple application on the surfaces to be contacted.
The thermal conductive materials (designated FSF 15 P and FSF 20 P) are solid when delivered and begin to flow at a phase change temperature between 52 and 48°C each. Microscopic unevennesses between heat source and a heat sink, for example, will be compensated, says Fischer. During the moistening, air escapes out of the area of the boundary layer, which leads to a significant reduction of the thermal impedance and simultaneously to an optimal heat transfer resistance. The material thicknesses vary from 0,114 up to 0,2mm whereby the customers can select the particular material thickness contact surfaces depending on the unevenness and roughness. The thermal conductivity of the new designs is within the scope of 1.5 to 2.0W/mK. For a simple handling and easier installation, both versions have one-sided, natural adhesive layer.
The basic material of the article FSF 15 P is available as sheet or roll material whereas the FSF 20 P is only available as sheet material in the dimension 300 x 400mm. Processing machines can be used to cut and contour the phase change materials according to customised drawing specifications.
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