Photorelays from Toshiba are in DIP4 package
Two high current photorelays introduced by Toshiba are fabricated using the latest U-MOS IX semiconductor process.
The TLP3553A and TLP3555A devices feature off-state output terminal voltage ratings of 30 and 60V, and on-state continuous current ratings of 4.0 and 3.0A – higher than previous generation products. When operated in pulsed mode, the current ratings increase to 9.0A for both devices.
The photorelays are used in industrial equipment, for example, PLCs, I/O interface and sensor controls, building automation systems such as heating, ventilation and air conditioning (HVAC), security equipment and the replacement of mechanical relays in legacy systems.
The TLP3553A features a low on-state resistance of just 50 mOhmm (maximum) which is less than a typical mechanical relay (about 100 mOhm). This ensures that operating losses are kept to a minimum when the device is used to replace mechanical relays such as 1-Form-A that are commonly used in industrial applications. The photorelays are rated for operation at temperatures between -40 and +110 degrees, making it easy to achieve a thermal margin in designs.
Toshiba reports that when mechanical relays are replaced with photorelays, such as the TLP355xA devices, system reliability is immediately improved. The photorelays are physically smaller than a mechanical relay, and no additional driver is required, saving both space and weight. Both TLP3553A and TLP3555A are provided in a DIP4 package and both with and without a surface mount option.
Both devices are now shipping in production quantities.
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