Power management IC reduces size of smart appliances

Rohm Semiconductor has introduced the BD71847AMWV, a power management IC (PMIC) optimised for NXP Semiconductors’ i.MX 8M mini applications processors to contribute to longer operating time and to reduce the size of smart speakers, networked audio, smart displays and other smart home appliances.

The BD71847AMWV has been added to Rohm’s portfolio of PMICs designed for NXP’s i.MX application processors. The i.MX ecosystem partner introduced the PMIC last year to support the i.MX 8M Quad and Dual applications processors.

i.MX 8M Mini applications processors allow customers to incorporate voice interface to audio/video streaming devices at minimal cost, explains Rohm. They integrate up to four Arm Cortex-A53 cores operating up to 1.8GHz along with an Arm Cortex-M4 or M7 that operates at up to 400MHz for low standby power consumption. For consumer and industrial application use, there is also support for 1080p video processing, 2D/3D graphics, advanced audio functions, and a variety of high-speed interfaces.

BD71847AMWV integrates all power rails required by the processor as well as power supplies for DDR and common system IO. In addition to DC/DC converters with what the company claims is industry-leading efficiency of 95 per cent, the PMIC features programmable power sequencer for flexible power control and management, seamless hardware control interface to i.MX 8M Mini, buffered sleep clock and protection functions. Customisation and programmability help to shorten development time, lower system bill of materials and to minimise footprint, says Rohm.

The PMIC integrates six DC/DC buck converter,  six low drop out regulators, 1.8V/3.3V power switch for SDXC cards, 32kHz crystal driver and buffered output clock, monitoring and protection circuits, and programmable sequencer and power state control logic.

The 2.7 to 5.5V input voltage range supports a variety of power sources, from single-cell Li-ion battery to USB and wall adapter.

The PMIC is offered in a compact 56-pin 7.0 x 7.0mm QFN package. The pin layout is carefully designed to ensure easy connection to NXP’s i.MX 8M Mini applications processor and DDR memory. Rohm estimates that the level of integration results in the number of external parts required by 42 and mounting area by 42 per cent compared with discrete solutions (assuming Type 3 PCB for single-sided mounting). With two-sided mounting, the board size could be as small as 300mm2.

The company has announced plans to expand its product portfolio to support future members of the i.MX 8M family.

The PMIC is sampling now, with OEM quantities expected in August 2019.


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