Power modules suit space-constrained applications

Distributor RS Components has added a family of high power density, encapsulated power modules from Renesas Electronics.

The family of high-efficiency power modules provide point of load (PoL) conversion for advanced FPGAs, DSPs, ASICs and memory used in servers, storage, optical networking, telecomms and space-constrained industrial applications.

The ISL8210M/12M/80M/82M power modules are single-channel, synchronous, step-down power devices that can deliver 10A or 15A of continuous current at the PoL. The integration of a PWM controller, inductor and MOSFETs is claimed to deliver the highest power density of any encapsulated module in their class.

The modules reduce the number of external components required and offer pin-to-pin compatibility; designers can select the appropriate current rating and the level of PMBus capability required, without having to modify the PCB layout.

The 10A and 15A power modules offer an analogue interface while two that come with an additional digital PMBus v1.3 interface. The analogue power modules are the ISL8210M and ISL8212M and the hybrid digital power modules are the ISL8280M and ISL8282M. The analogue-loop modules offer a higher power density, expanded feature set via pin-strappable settings, and lower cost when compared to previous power modules from Renesas.

Other features are operation from a single 4.5V to 16.5V wide-input power rail, selectable light-load mode (PFM), efficiency up to a peak of 95 per cent and low thermal resistance, enabling full power operation without a heatsink in the majority of application environments.

The modules implement Renesas Electronics’ proprietary R4 high-speed control loop technology to eliminate external compensation components, while providing best-in-class fast transient response across the load and input voltage. The output voltage is fully stable with all ceramic capacitors, adds RS Components. The ISL8280M/82M digital PMBus interface modules are also capable of further optimising the control loop, overriding pin-strap settings, and providing extensive telemetry.

The ISL82xxM family is shipping now. It is available in compact and thermally enhanced 12 x 11 x 5.3mm grid HDA (high density array) packages, eliminating the need for additional heatsink or internal fans, and only requiring a few external components for operation, confirms RS Components. The power module family is supported by four development boards that are designed for the evaluation of each of the ISL8210M/12M/80M/82M modules.


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