Power-on-Package MCMs provide up to 1000A peak current

A Power-on-Package (PoP) ChiP-set announced by Vicor includes modular current multipliers (MCMs) for high performance GPU, CPU and ASIC (XPU) processors. The PoP MCMs multiply current and divide voltage from a 48V source in close proximity to XPUs to enable higher levels of XPU performance. Power distribution efficiency and system density rise beyond the limitations of conventional 12V input multi-phase voltage regulators lacking current multiplication. According to Vicor, PoP is an enabling technology for high current artificial intelligence (AI) processors and 48V autonomous driving systems.

PoP modules build upon Factorized Power Architecture (FPA) used in high performance computers and large data centres. Vicor’s FPA supports efficient power distribution and direct conversion from 48V to sub-1.0V XPUs. PoP MCMs overcome previous barriers to improved performance with current multiplication deployed in close proximity to high current processors, adds Vicor.

The MCM4608S59Z01B5T00 (MCM) and a MCD4609S60E59H0T00 modular current multiplier driver (MCD) provide 600A continuous and up to 1000A peak at up to 1.0V. MCMs are high density devices in low profile packages (46 x 8.0 x 2.7mm) and with low noise attributes, making them suitable for co-packaging within the XPU substrate or adjacent to it. Close proximity to the XPU eliminates substantial power loss and bandwidth limitations incurred in the ‘last inch’ of the current delivery path from the boundaries of 12V multi-phase regulators, adds Vicor.

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