Qorvo expands PAC portfolio with single-chip intelligent battery management

Two devices have been added to the Qorvo power management portfolio. The PAC22140 and PAC25140 Power Application Controller (PAC) devices are believed to be the industry’s first single-chip devices to offer support for battery packs with up to 20 cells in series. Both leverage an intelligent motor control foundation to enable intelligent battery management for a wide range of industrial, e-mobility and battery backup applications.

The integrated PAC22140 and PAC25140 save designers more than 50 per cent of PCB space and lower total bill of materials cost by 30 per cent, while reducing time to market leveraging Qorvo’s hardware and firmware ecosystem. 

Both devices integrate essential analogue and power management peripherals with a 32-bit Arm Cortex M0 or M4F microcontroller and include cell balancing, monitoring and protection for 10- to 20-cell battery packs.

Peripherals include a programmable-gain differential amplifier, multiple 16-bit Sigma-Delta ADCs for current and voltage sensing and a 10-bit SAR ADC. A single supply 145V buck DC/DC controller generates a 5.0V system rail to power the device. An integrated charge pump supports the charge and discharge FET drivers. 

Higher cell counts are in demand for longer battery life, faster charging time and lighter overall weight from new battery-powered applications, explained Brian McCarthy, senior manager for Qorvo’s PAC product line. “The highly integrated PAC22140 and PAC25140 provide designers complete solutions for these high-power, high-performance systems,” he said.

The PAC22140 and PAC25140 provide a low power hibernate mode of less than 3.0 microA, enabling long storage time with wakeup from push button, timer or charger detection. The integrated high-voltage buck reduces thermal issues by supporting the system with a 5.0V regulated supply up to 225mA. An integrated 3.3V LDO supplies up to 90mA for running additional peripherals. An analogue MUX is connected to the SAR ADC for safety checks on internal nodes.

The PAC22140 is in volume production today, and is available in a 9.0 x 9.0mm, 60-pin QFN package. The PAC25140, sampling today with production in April 2023. It is available in a 10 x 10mm, 68-pin QFN package. 

Qorvo also offers PAC22140EVK1 and PAC25140EVK1 hardware development kits. Pre-production samples of the PAC25140 and PAC25140EVK1 are available on request.

The PAC22140, PAC25140, PAC22140EVK1 and PAC25140EVK1 will be highlighted at Embedded World 2023 (14 to 16 March) in Nuremberg, Germany Hall 4-578. 


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