QSMP system-on-module makes handling easier, says Direct Insight
A solder-down QSMP system-on-module (SoM) based on STMicroelectronics’ ST32M1 Arm Cortex-A7 solves production challenges because of its tiny QFN-style package, says Direct Insight. The QSMP module is manufactured by Direct Insight’s partner, Ka-Ro Electronics.
The module is based on the STMicro ST32M1 processor provides a single or dual 650MHz Arm Cortex-A7 core as well as a separate Arm Cortex-M4 running at 200MHz. It also has up to 512Mbyte of DDR3L RAM, up to 4Gbyte eMMC flash and a range of interfaces. The low-power operation ST32M157C processor can offer a powerful 3D graphics processor unit (GPU), secure boot and an AES/TDES/SHA crypto-engine, adds Direct Insight.
The QSMP SoM measures 27 x 27 x 2.3mm. It features a solder-down package with a QFN-type pin-out based on a 1.0mm pitch with 100 edge-located pads. This design aids inspection and simplifies routing, even permitting a two-layer baseboard and a base plane, says the company. The ground plane design ensures that the modules effectively ‘float’ into position during reflow, explains Direct Insight, offering an advantage over a ball grid array (BGA) package which requires x-ray inspection to ensure full connectivity. The company also claims that the QS solder-down modules are so small that warping does not occur.
The design of the package also improves thermal efficiency and EMI performance because the base functions as both a ground pad and a thermal conductor. Modules operate across an industrial temperature range of -40 or -25 to +85 degrees C.
The module features a wide range of connectivity options including CANbus (ST32M153A and ST32M157C), three UART, two SPI, two I2C, audio, Gbit Ethernet, SD, USB host and client and a parallel or MIPI-DSI (ST32M157C) display interfaces. The module requires a single 3.3V supply.
The ST32M1 Arm Cortex-A7-powered QSMP SoM comes with a dedicated development system, equipped with Linux board support package (BSP).