Richardson RFPD supports 5G mMIMO RF PAs from NXP
A portfolio of RF power multi-chip modules available from Richardson RFPD supports massive MIMO active antenna systems for 5G basestations.
The distributor, an Arrow Electronics company, has announced availability and full design support capabilities for the RF power multi-chip module (MCM) portfolio for 5G mMIMO from NXP Semiconductors.
These devices are part of NXP’s 5G Airfast product family and include LDMOS power amplifier (PAs) modules, GaAs pre-driver modules and receiver modules for cellular frequency bands from 2.3 to 3.8GHz, with output power from 3.0 to 5.0W.
The fully integrated power amplifier modules have high-performance in-package Doherty, fully matched 50 Ohm input/output, multiple gain stages and a small footprint. According to Richardson RFPD, this combination makes them particularly suitable for scaling mMIMO 5G configuration up to 64T64R.
The RF power MCM modules available include the following PA modules: AFSC5G37D37 (3.7GHz band, +37dBm average), AFSC5G35D37 (3.5GHz band, +37dBm average), AFSC5G35D35 (3.5GHz band, +35dBm average), AFSC5G26D37 (2.6GHz band, +37dBm average) and AFSC5G23D37 (2.3GHz band, +37dBm average).
Evaluation boards are also available.
The pre-driver modules available are: AFLP5G35645 (3.5 and 3.7GHz bands, +29dBm average) and AFLP5G25641 (2.3 and 2.6GHz bands, +29dBm average).
Receiver modules are the AFRX5G372 (LNA+switch for 3.5 to 5.0GHz bands) and the AFRX5G272* (LNA+switch for 2.3 and 2.6GHz bands).
Samples available upon request.
Richardson RFPD, an Arrow Electronics company, specialises in the RF, wireless, IoT and power technologies markets. It has relationships with many of the industry’s top RF and power component suppliers. Whether designing components or engineering complete solutions, Richardson RFPD’s worldwide design centres and technical sales team can provide comprehensive support from prototype to production stages.
