RS Components adds Renesas Synergy AE-Cloud2 kit
Created to speed LTE IoT connectivity development, the Renesas Synergy AE-Cloud2 kit is now available from RS Components.
The development board kit uses latest cellular communication protocols for fast evaluation, prototyping and development of cloud-connected IoT applications.
The kit from Renesas Electronics is now available and shipping from RS in the EMEA and Asia Pacific regions.
The AE-Cloud2 kit helps embedded developers to quickly and easily connect IoT devices and sensors to global cloud services via cellular (Note), Ethernet or Wi-Fi communications. It also allows them to evaluate new narrowband low power wide area network (LPWAN) cellular radio options including the CAT-M1 and NB-IoT protocols, which have been specially developed for use in IoT applications.
The kit’s main processor board has a Renesas Synergy S5D9 microcontroller (MCU), which integrates a 120MHz Arm Cortex-M4 processor core, 2Mbyte of code flash memory, up to 640Kbyte of SRAM and 64Kbyte of data flash. The MCU’s flash memory capability is expanded with an external 32Mbyte memory device connected via a high-speed quad-SPI, which can be used for the storage of graphics and other digital assets. There is a wide sensor selection including devices for sensing light, sound, temperature, humidity, pressure and air quality, as well as accelerometer and gyroscope measurement devices, and a geomagnetic sensor for compass navigation.
The kit also contains Wi-Fi and LTE-CATM1 connectivity boards, plus cellular and GPS antennae, and USB and Ethernet cables.
The AE-Cloud2 kit can connect to a number of different IoT cloud platforms as well as the Renesas Synergy Enterprise Cloud Toolbox. This is a demo application that enables fast connection to major cloud services, including Amazon Web Services, Microsoft Azure or Google Cloud, to display a web dashboard for visualising sensor data.
The kit can be used globally with support for Cat-M1, Cat-NB1 and 2G/EGPRS, as well as GPS. It also complies with global regulatory certifications for FCC, CE, RoHS, WEEE and Japan MIC.