Rutronik introduces Kemet’s MLCCs with Konnekt technology
Konnekt technology is Kemet’s solution to connect several MLCCs to a single surface mountable component. The high-density housing technology can connect components without a metal frame, explained Rutronik. It helps to significantly reduce the equivalent series resistance (ESR), equivalent series inductance (ESL), and thermal resistance of capacitors, added the distributor which offers the technology.
The surface-mount U2J, KC-LinkTM, and C0G capacitors are primarily designed for power applications with high efficiency and high packing density. Kemet’s X7R series capacitors are used when higher capacitances and voltages are required additional space on the PCB. The capacitors (U2J, KC-LinkTM, X7R, and C0G) are available from Rutronik in case sizes 1812, 2220 and 3640.
Konnekt technology uses a TLPS (transient liquid phase sintering) material in which a low melting point metal or alloy reacts at low temperature with a high melting point metal or alloy to form a reactive metal matrix. The result is a highly conductive interconnect material that can be used to join multiple MLCCs, reported Rutronik. The result is stacked multi-chip devices without lead frames that can be aligned horizontally and vertically. This makes it easy to reduce the space required on the PCB.
In addition to saving space on PCBs, the technology can be used for commercial and automotive quality designs with a wide temperature range of -55 to +150 degrees C.
It can also be used for wide bandgap, silicon carbide (SiC) and gallium nitride (GaN) based systems, data centres, EV/HEV (drive systems, charging), LLC resonant converters, switched tank converters, wireless charging systems, photovoltaic, power converters, inverters, DC links and snubbers.
Rutronik Elektronische Bauelemente was founded in 1973 and remains an independent family-owned company based in Ispringen, Germany.
It has more than 80 offices worldwide and logistics centres in Austin (Texas), Shanghai, Singapore, and Hong Kong, with customer support in Europe, Asia, and North America. The company focuses on high-growth future markets which are advanced materials, advanced measurement, processing and analytics, advanced robotics, automation, biotechnology, energy and power, future mobility, IIoT and internet of everything, industry 4.0, medical and healthcare, and transportation, logistics and supply chain.
