Security IC using 28nm targets high volume payment systems

Believed to be the first 28nm-based security IC, the SLC26P targets high volume payment applications. based on the future-proof 28 nm technology node.

According to Ioannis Kabitoglou, head of digital security and identity, at Infineon, the use of 28nm technology represents the company’s long term commitment to the security IC market. It is planning for a fast ramp up of production  Business Line of Infineon. It plans a fast ramp up in the first half of next year to relieve the semiconductor shortages currently experienced by the security IC sector.

The SLC26P is claimed to be the first security controller optimised for payments based on the 28nm technology. An EMVCo certification, for multi-vendor card transations, is expected to be available in December 2022. 

The IC features Arm v8-M architecture optimised for deeply embedded systems and designed for low-latency processing.

Infineon and partner TSMC have developed the security IC products. Capacity issues at mature technologies like 90, 65 and 40nm have been a limiting factor for the strong demand in security applications, leading silicon foundries to build new capacity. The 28nm technology node for security ICs offers increased sourcing flexibility but also conrtributes to higher performance, more energy efficient and environmentally-friendly products for this segment, said Infineon. 

The portfolio of products based on 28nm process technology is expected to meet demand for smart card and embedded security IC applications, such as payment and transportation, as well as identity and authentication, in the coming years.

Infineon plans to ramp up production in the first half of 2023. Samples based on SLC26P are available upon request.

Infineon will be at TRUSTECH (booth G035, 5.2) in Paris, Porte de Versailles, from 29 November until 1 December 2022. Experts will be available for discussions about Infineon’s security controller offering based on 28nm technology.

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